Laird Announces New Bluetooth 5 Series for Unmatched Multi Wireless Bluetooth Low Energy, Thread (802.15.4), and NFC Connectivity

New Bluetooth 5 series delivers four times’ the range and twice the data throughput

LONDON, February 15, 2018 – Global technology leader Laird (LRD: London) today announced a new Bluetooth 5 series that enables vital performance improvements with up to four times’ the range and twice the data throughput, opening up new product opportunities for industrial, medical, and Internet of Things (IoT) applications.

Laird’s new BL654 Series builds upon its field-proven BL600 and BL652 series, reducing engineering burden and design risk, and speeding time-to-market when integrating Bluetooth Low Energy (BLE), as well as Thread (802.15.4) and NFC capabilities into an OEM design.

In addition to the stand-out Bluetooth 5 features of enhanced data rates and LE Long Range, the BL654 also integrates BLE Mesh capabilities in a high TX power platform, providing innovative new application possibilities for low power, long-range mesh sensor networks.

Based on Nordic Semiconductor nRF52840 silicon, the BL654 ultra-small modules, development kits, and USB-packaged adapter provide a secure, robust, multi-wireless plus Cortex -M4F MCU platform for any product design. The BL654 delivers maximum development flexibility with programming options for the Nordic SDK in C; a simple, intuitive AT Command Set, as well as Laird’s smartBASIC event-driven programming environment.

Laird’s smartBASIC is a proven event-driven programming language that makes integration easier for designers, especially those who may be new to Bluetooth wireless technology. The programming language offers built-in functions that replace thousands of lines of C code and allows designers to leverage Laird’s years of Bluetooth expertise. It also acts as a bridge between software and hardware, allowing an application to work on any smartBASIC radio.

“Our BL654 family of modules, adapters and development kits enable OEMs to drive their entire product development from a single, integrated multi wireless MCU core platform with multiple software development environments that the engineer can pick to best serve their needs,” said Laird Senior Vice President Scott Lordo.

The BL654 is especially ideal for the IoT, where many companies may not have any background in RF design or BLE wireless technology, Lordo added. By using the BL654, they will be able to access the latest market-leading wireless technology without the steep learning curve, design risk, and time that it will typically involve.

The BL654 family also boasts robust security, industrial temperature rating, a tiny footprint — as small as 15 x 10mm — and modular FCC, IC, CE, MIC, RCM and Bluetooth SIG approvals, which extend to an OEM’s design with no new testing for the fastest route to production.

“As a trusted partner, Laird is at the forefront of developing BLE solutions,” Lordo said. “The BL654 was designed with our customers in mind, enabling further progress into IoT enablement such as industrial and commercial applications, where the extended range and capabilities of Bluetooth 5 are needed.”

Laird will introduce the BL654 Series along with several new connectivity products at Mobile World Congress 2018, February 26- March 1, 2018, at the Fira Gran Via in Barcelona, Spain. Guests are welcomed to stop by Hall 7 Stand 7C71 or schedule a meeting in advance to discuss their wireless connectivity needs and applications, and learn how Laird can support their mission critical cellular, IoT, and embedded wireless applications.

About Laird:

Laird is focused on providing systems, components and solutions that protect electronics from electromagnetic interference and heat, and that enable mission critical connectivity through wireless applications and advanced antenna systems. Laird’s products are critical to all sectors of the electronics industry, including transportation, industrial, medical, telecommunications, computing, and the mobile device sectors. Laird employs nearly 9,700 employees at 48 locations, including 20 engineering and manufacturing facilities, 18 research and design centers, and 10 sales and administrative offices, in 19 countries worldwide.